高周波・RFニュース 2024年11月4日 IEEE Antennas and Propagation Magazineでアンテナ技術の進化とアレイのレビュー、EMC EuropeでAIをDe-embeddingに応用、I-PEXがシールド付き細線同軸コネクタ発表、iPhone 17からApple製Wi-Fiチップ?Huaweiの5G-Aᴬ

・IEEE Antennas and Propagation Magazineでアンテナ技術の進化とアレイのレビュー

https://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=74

八木・宇田アンテナからログペリまで、またミリ波アンテナアレイのレビューの記事あり。

・EMC EuropeでAIをDe-embeddingに応用

A Novel De-embedding Method Based on Artificial Neural Network

・QorvoのWi-Fi 7　FEMがMediaTekに採用

Qorvo® Selected by MediaTek as Key Supplier for the Inaugural Wave of Wi-Fi 7 FEMs Used in MediaTek Dimensity 9400

・I-PEXがシールド付き細線同軸コネクタ発表

新製品リリース：情報通信機器向けコネクタ CABLINE^®-CA IIF PLUSを販売開始（2024/11/1）

・Ming-Chi KuoがiPhone 17からApple製Wi-Fiチップになると語る

I get why some people want to see, in the short term, a dramatic boost in iPhone shipments thanks to Apple Intelligence. However, looking back over 20 years of consumer electronics, it's extremely rare to see software or service upgrades alone driving a significant surge in…

— 郭明錤 (Ming-Chi Kuo) (@mingchikuo) October 31, 2024

その他：

Ericsson targets high-performing programmable networks with new 5G Advanced software

Huawei Launches 5G-A^A Solutions for the Mobile AI Era

Marvell : Nine Things to Remember About the Future of Copper in Computing

MaxLinear Launches Broad Portfolio of Half-Duplex RS-485 Transceivers Designed for Demanding Applications