高周波・RFニュース 2025年3月5日 QorvoがKuバンドのビームフォーマーIC発表、SEMCOが産業向け1206 inch, 220uF, X6S, 4VのMLCC発表、TDKの新μPOL、KeysightがAnalogDevicesと共同で6G FR3デモ、STMが新ワイヤレス内蔵マイコン発表、MWC2025での無線モジュール発表あれこれ

・QorvoがKuバンドのビームフォーマーIC発表

Qorvo Launches Next-Gen Ku-Band Beamformers for High-Performance SATCOM Terminals

・SEMCOが産業向け1206 inch, 220uF, X6S, 4VのMLCC発表

Samsung Electro-Mechanics Industrial High Capacitance MLCC (1206 inch, 220uF, X6S, 4V)

・TDKの新μPOL

電源製品: 高電力密度アプリケーション向けテレメトリ機能を備えたμPOL™ DC-DC コンバータの開発と量産

・KeysightがAnalogDevicesと共同で6G FR3デモ

Keysight to Demonstrate 6G FR3 Characterization Leveraging ADI Technology at Mobile World Congress 2025

・STMが新ワイヤレス内蔵マイコン発表

STMicroelectronics’ new integrated STM32WBA6 wireless microcontrollers combine extra features and performance with power efficiency

その他MWC2025年関係

Quectel launches 5G transparent antenna, redefining connectivity aesthetics

Sequans Monarch Powers Coyote Nano 2.0 new generation of Stolen Vehicle Tracker

u-blox introduces PointPerfect Live, bringing fast, reliable, and scalable network RTK to high-precision GNSS applications

Telit Cinterion Launches AI-Powered 5G Modules and Data Cards with Qualcomm’s Cutting-Edge Modem

MWC Barcelona 2025 Fibocom Debuts Compact, Low-Power Cat.M Module MQ780-GL Powered by Qualcomm Modem-RF

Marvell Demonstrates Industry’s Leading 2nm Silicon for Accelerated Infrastructur

MediaTek Expands Cloud-to-Edge Leadership with Next-Generation Connectivity and AI at MWC 2025
Showcasing 6G Hybrid Computing Technologies, 5G-Advanced Modem, NR-NTN and Generative AI Gateways