高周波・RFニュース 2025年9月18日 LitepointがWi-Fi 8用のテストソリューション発表、BroadcomがホンダセンターのWI-Fiを6GHz帯に、SEMCOが3224サイズ330μFと車載1005 X7S 470nF MLCC発表、Telitがデッドレコニング対応のGNSSモジュール発表など

・LitepointがWi-Fi 8用のテストソリューション発表

LitePoint Announces Innovative Test Solution for Wi-Fi 8

The LitePoint IQxel-MX platform is leading the charge in the development and validation of next era, dependable, and ultra-high reliability Wi-Fi 8 applications

・BroadcomがホンダセンターのWI-Fiを6GHz帯に 

Indoor Standard Power 6 GHz Wi-Fi Deployment Shines Bright at Honda Center

 

・SEMCOが3224サイズ330μFと車載1005 X7S 470nF MLCC発表

Introducing Samsung Electro-Mechanics’ Industrial Ultra–High-Capacitance MLCCs (1206 inch, 220 µF & 1210 inch, 330 µF)

Samsung Electro-Mechanics presents the Ultra-Small Automotive MLCC (0402 inch, X7S, 16 V, 470㎋)

・Telitがデッドレコニング対応のGNSSモジュール発表

Telit Cinterion SE869eK5-DR GNSS Module Delivers Location Reliability and Accuracy With Untethered Dead Reckoning  

その他：

MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance andPower Efficiency

STMicroelectronics to advance next-generation chip manufacturing technology with new PLP pilot line in Tours, France

iFixit :

About That iPhone Air Battery…