高周波・RFニュース 2026年3月3日 MWC2026で各社がさらに展示内容をプレスリリース（SkyworksはFR3対応のフロントエンドモジュール、QualcommはR19対応モデムX105、BroadcomはVMware Telco Cloud Platform 9 、IntelはAI-Readyネットワーク、NordicはCat 1 bisモジュールなど）

・MWC2026で各社がさらに展示内容をプレスリリース

Skyworks and MediaTek Showcase Early 6G FR3 and PC1 RF Front-End Innovations at MWC 2026

Broadcom Announces VMware Telco Cloud Platform 9 to Drive Greater Hardware Efficiency for Sovereign-Ready Telco Infrastructure

Qualcomm Announces 5G-Advanced Leap with Qualcomm X105 5G Modem-RF – World’s First R19-Ready Modem, Laying the Foundation for 6G

Qualcomm accelerates 6G trajectory to drive device-to-data-center transformation for leading network providers

FastConnect 8800: Redefining AI-ready connectivity with 4x4 Wi-Fi and Wi-Fi 8

Smarter 5G Today, Seamless Path to 6G: Intel’s AI-Ready Network Vision

Nordic Semiconductor debuts low-power nRF93M1 Cat 1 bis module at MWC 2026

MaxLinear Showcases Accelerating Sierra Momentum with Multiple O-RAN Radio Units at MWC 2026

Sivers Semiconductors to Showcase Cutting-Edge SATCOM and Fixed Wireless Innovations at MWC Barcelona

Quectel expands mid-tier 5G portfolio with new RedCap 3GPP release 17 variants

Ericsson, Sony and Vodafone to highlight 5G professional photography breakthrough at MWC

MediaTek Exemplifies AI and Connectivity Leadership at MWC 2026

その他

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